關於台積電博士獎學金
為帶動台灣整體半導體產業之關鍵人才質量及研發能量，持續推動先進技術之發展，台積電於2020年設立此獎學金，鼓勵優秀學生投入半導體相關領域攻讀博士學位，並與學校教授共同打造頂尖的產學合作環境。
- 獎助內容
- 博士修業期間每年獎助新台幣50萬元整，至多獎助五年。
- 台積業師：由台積資深主管擔任業師，協助了解產業、技術發展階段與挑戰。
- 帶薪實習：在學期間安排至台積實習。
- 畢業後經審核將優先任用，表現優異者享有差異化薪資待遇。
- 申請資格
- 具中華民國國籍之國內大學半導體領域相關科系博士班一年級生，或已獲入學許可之準博士生，規劃從事半導體相關領域研究(如下)，並經指導教授推薦者。
- 研究領域
- Semiconductor devices - device development, electrical characterization methodology & physics, and TCAD.
- Semiconductor processes, material science, and modeling - plasma physics, surface chemistry reaction, selective deposition on dielectric/conductor, electro-chemistry, atomic-layer deposition/etch, organic/in-organic chemistry synthesis, physical chemistry, lithography, e-beam, chemical vapor deposition, physical vapor deposition, and vacuum system.
- Exotic devices and materials - spintronics, magnetism, two-dimensional (2D) materials.
- Compact modeling about semiconductor electrical/magnetic devices, interconnection, radio-frequency mmWave, three-dimensional IC (3DIC), microelectromechanical system (MEMS) and bio-sensor.
- Algorithm development for model extraction/characterization or methodology for new applications of SPICE simulation.
- First-principles modeling of material characteristics (electrical, magnetics, etc.), material design and synthesis for nano-scale fabrication.
- Electronic design automation (EDA) and methodology, focusing on tool/methodology for future design-technology co-optimization (DTCO).
- Next-generation design architectures including: three-dimensional IC (3DIC), power distribution network, standard cells, memory, input/output (IO), and etc.
- Other semiconductor-related topics.