講者：Prof. Cheng-Kok Koh

日期：1/28 (一)

時間：2:30p.m.-4:00p.m.

地點：EC345

主持人：李毅郎副教授

演講大綱：With aggressive technology scaling, the accurate and efficient modeling and simulation of interconnect effects are problems of central importance. In a three-dimensional interconnect structure there can be a significant amount of coupling, both inductive and capacitive, between interconnects. Models that capture these effects tend to involve large matrices, resulting in extraordinary demands on memory. Moreover, simulation with these models requires prohibitive amounts of computation. In this talk, we present a formulation for typical VLSI interconnect structures that, in addition to providing a compact set of modeling equations, also offers a potential for exploiting sparsity at the simulation level. The numerical efficiency of our approach is realized through linear-algebraic techniques that exploit the sparsity and structure of the matrices that are encountered in VLSI structures. Numerical results show that our approach is orders-of-magnitude faster than commercial-grade SPICE with little sacrifice in simulation accuracy.

講者簡介：Cheng-Kok Koh received the B.S. degree with first class honors and the M.S. degree, both in computer science, from the National University of Singapore in 1992 and 1996, respectively. He received the Ph.D. degree in computer science from University of California at Los Angeles in 1998. Currently, he is a Professor of Electrical and Computer Engineering at Purdue University, West Lafayette, Indiana. His research interests include physical design of VLSI circuits and modeling and analysis of large-scale systems. Dr. Koh was the recipient of the 1990 Lim Soo Peng Book Prize for Best Computer Science Student presented by the National University of Singapore, and the Tan Kah Kee Foundation Postgraduate Scholarship (1993 and 1994), the GTE Fellowship and the Chorafas Foundation Prize presented by UCLA (1995 and 1996), the 1998 ACM Special Interest Group on Design Automation (SIGDA) Meritorious Service Award and Distinguished Service Award, the 1999 Chicago Alumni Award presented by Purdue University, the 2000 National Science Foundation CAREER Award, and the 2002 ACM/SIGDA Distinguished Service Award.